Custom Enclosures

Cases & Cups

Molded Encapsulating Case

Bobbins & Spools

Headers / Covers

G10 / FR4 Sheets Black & Natural

Engineering Info
Cases & Cups
Encapsulation Cases & Cup for Electronic Component Packaging.

Cups are fabricated from *G10/FR4 and XPC Phenolic.

Headers available to fit the inside or the outside of all cases and cups.

Round cups also can be fabricated from Epoxy filled and unfilled tubing.

Excellent resistance to chemical attack from both acid and alkaline material.

High flexural deformation temperatures (150 C -160 C).

Molded cups: we have many sizes available from stock or we can mold it to your spec. all molded material meet the requirements of UL94-V0.

SECONDARY OPERATIONS AVAILABLE: Drilling holes, slots, installation of terminal and Insert, center post and sanding.